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Sn-Ag Alloy Plating Process for Bump

Features

  • Excellent bump shape can be achieved.
  • No voids after wetback.
  • Bump fabrication with various Sn-Ag alloy compositions.

  • TS-3500 after reflow

    Excellent bump shape can be achieved after reflow.
    Left Left-Center Center
    Surface TS-3500 Surface Left TS-3500 Surface Left-Center TS-3500 Surface Center
    Shape TS-3500 Shape Left TS-3500 Shape Left-Center TS-3500 Shape Center

    TS-3500 Reflow capability (SEM)

    SEM x200 SEM x800
    After plating Bump Shape of Cu pillar / As Plate / SEM x200 Bump Shape of Cu pillar / As Plate / SEM x800
    After reflow Bump Shape of Cu pillar / After Reflow / SEM x200 Bump Shape of Cu pillar / After Reflow / SEM x800
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